multilayer Buried resistance PCB Manufacturers

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Hot Products

  • FR-5 PCB

    FR-5 PCB

    FR-5 PCB epoxy board is made of special electronic cloth soaked with epoxy phenolic resin and other materials by high temperature and high pressure hot pressing. It has high mechanical and dielectric properties, good insulation, heat and moisture resistance, and good machinability
  • TU-943N High-speed PCB

    TU-943N High-speed PCB

    TU-943N High-speed PCB -- the development of electronic technology is changing with each passing day. This change mainly comes from the progress of chip technology. With the wide application of deep submicron technology, semiconductor technology is becoming increasingly physical limit. VLSI has become the mainstream of chip design and application.
  • XC9572XL-7VQ44I

    XC9572XL-7VQ44I

    ​XC9572XL-7VQ44I is a complex programmable logic device (CPLD) produced by Xilinx. This chip has high flexibility and scalability, supporting programming using HDL (Hardware Description Language) such as VHDL and Verilog to meet various complex functional requirements.
  • XC7K410T-2FBG676C

    XC7K410T-2FBG676C

    XC7K410T-2FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • XC7K325T-L2FBG900E

    XC7K325T-L2FBG900E

    ​XC7K325T-L2FBG900E is a model of the Xilinx Kintex-7 family of field-programmable gate arrays (FPGAs). These FPGAs offer high-performance processing capabilities and are widely used in various applications such as wireless communication, high-speed connectivity, and video processing.

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