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Hot Products

  • 5CSEBA6U23C7N

    5CSEBA6U23C7N

    5CSEBA6U23C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CGXFC7C6U19I7N

    5CGXFC7C6U19I7N

    5CGXFC7C6U19I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 24G RO4003C RF PCB

    24G RO4003C RF PCB

    The RF module is designed with RO4003C 20mil thickness PCB board, but RO4003C does not have UL certification. Can some applications requiring UL certification be replaced by RO4350B with the same thickness?The following is about 24G RO4003C RF PCBrelated, I hope to help you better understand 24G RO4003C RF PCB
  • BCM5396KFBG

    BCM5396KFBG

    BCM5396KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCF08PFS48C

    XCF08PFS48C

    XCF08PFS48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU060-1FFVA1517I

    XCKU060-1FFVA1517I

    ​XCKU060-1FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.

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