LTM4630IY#PBF Manufacturers

Our company puts emphasis about the administration, the introduction of talented staff, along with the construction of employees building, seeking hard to boost the standard and liability consciousness of staff members members. Our business successfully attained IS9001 Certification and European CE Certification of LTM4630IY#PBF, Sincerely stay up for serving you from the in the vicinity of future. You are sincerely welcome to go to our company to talk company face to face with each other and create long-term co-operation with us!
LTM4630IY#PBF, With nearly 30 years' experience in business, we have been confident in superior service, quality and delivery. We warmly welcome customers from all over the world to cooperate with our company for common development.

Hot Products

  • XAZU5EV-1SFVC784Q

    XAZU5EV-1SFVC784Q

    ​XAZU5EV-1SFVC784Q is an FPGA chip launched by Xilinx, belonging to the XA Zynq UltraScale+MPSoC series. This chip integrates a feature rich 64 bit quad core Arm Cortex-A53 processor and dual core Arm Cortex-R5 processing system (PS), as well as the UltraScale architecture of Xilinx programmable logic (PL), all integrated into a single device. In addition, it also includes on-chip memory, multi port external memory interfaces, and a rich set of peripheral connection interfaces
  • 5SGXEA4H2F35I3G

    5SGXEA4H2F35I3G

    ​5SGXEA4H2F35I3G is an FPGA (Field Programmable Gate Array) product produced by Altera Corporation. This FPGA is packaged in 1152-BGA and features high performance, low power consumption, and flexible programmability, making it suitable for various application scenarios. Specifically, 5SGXEA4H2F35I3G has the following characteristics and advantages:
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • HI-8282APJI

    HI-8282APJI

    HI-8282APJI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5M80ZE64C5N

    5M80ZE64C5N

    5M80ZE64C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • S1D13700F02A100

    S1D13700F02A100

    S1D13700F02A100 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

Send Inquiry