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    Rigid-Flex PCB

    The Rigid-Flex PCB has the characteristics of FPC and PCB. Therefore, it can be used in some products with special requirements. It has not only a certain flexible area, but also a certain rigid area, which is of great help to save the internal space of the product, reduce the volume of the finished product, and improve the performance of the product.
  • XC5VLX110T-1FFG1136I

    XC5VLX110T-1FFG1136I

    XC5VLX110T-1FFG1136I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Megtron7 PCB

    Megtron7 PCB

    Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.
  • XC5VLX50T-1FFG1136C

    XC5VLX50T-1FFG1136C

    XC5VLX50T-1FFG1136C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S200AN-4FT256I

    XC3S200AN-4FT256I

    XC3S200AN-4FT256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-3FGG484C

    XC6SLX45-3FGG484C

    XC6SLX45-3FGG484C is a field-programmable gate array (FPGA) manufactured by Xilinx, a leading company in the development of advanced semiconductor technology. This particular device has a density of 45,408 logic cells, 2.1 Mb of distributed RAM,
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    On April 24, Han's Laser released its 2016 annual report and a quarterly report for 2017. During the reporting period, it achieved operating income of 6.959 billion yuan, a year-on-year increase of 24.55%, and realized net profit of 754 million yuan. In 17Q1, profit increased by 31.50%, and the profit growth rate in the first half of the year is expected to be 60%-90%.

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    Reasons for blistering of multilayer circuit board

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    At present, most of the holes drilled in the double-sided flexible printed board are still drilled by the NC drilling machine. The NC drilling machine is basically the same as that used in the rigid printed board, but the drilling conditions are different. Because the flexible printed board is very thin, multiple pieces can be overlapped for drilling. If the drilling conditions are good, 10 ~ 15 pieces can be overlapped for drilling.

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    According to the base material, PCB can be divided into flexible circuit board, rigid circuit board and rigid flexible combination plate, which are used in different equipment according to different purposes.

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    Printed circuit board (PCB), also known as printed circuit board, is a provider of electrical connection of electronic components

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    Semiconductors refer to materials with conductivity between conductor and insulator at room temperature. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in the application of various semiconductor materials

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