HI-8585PSI Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

XCKU035-1FFVA1156C
XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications
XC6VSX475T-2FF1156E
XC6VSX475T-2FF1156E Package BGA Integrated Circuit Chip IC Electronic Component Inquiry and Order
5AGXBA3D4F31C5G
The 5AGXBA3D4F31C5G device series includes the most comprehensive mid-range FPGA products, ranging from the lowest power consumption for 6 Gigabit per second (Gbps) and 10Gbps applications to the highest mid-range FPGA bandwidth of 12.5 Gbps transceivers.
5G Optical Module PCB
10G SFP+ LR is a high performance, cost effective modules, which is supporting Multi Rate 2.4576Gbps to 10.3125Gbps, and transmission distance up to 10km on SM fiber. The transceiver consists of two sections: The transmitter section incorporates a laser driver and a 1310nm DFB laser.The following is about 5G Optical Module PCB related, I hope to help you better understand 5G Optical Module PCB.
XCVU13P-2FLGA2577E
XCVU13P-2FLGA2577E Virtex™ UltraScale+ ™ The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
10 Layer 4Step HDI PCB
HDI is the English abbreviation of High Density Interconnector, high-density interconnect (HDI) manufacturing printed circuit board. The printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. The following is about 10 Layer 4Step HDI PCB related, I hope to help you better understand 10 Layer 4Step HDI PCB.

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PCB proofing layout setting skills
PCB proofing, as a component of high-precision electronic products, has been a very common existence in life. However, we all know that domestic professional PCB proofing design needs different point settings in different stages, and large grid points will be used for device layout in the layout stage. Let's take a look at the detailed PCB proofing layout setting skills.
High-precision multi-layer circuit board PCB proofing, four major production difficulties can not be ignored
Multi-layer PCBs are used as the "core main force" in the fields of communications, medical treatment, industrial control, security, automobiles, electric power, aviation, military industry, and computer peripherals. Product functions are getting higher and higher, and PCBs are getting more and more sophisticated, so relative to the difficulty of production Also getting bigger.
Polar models flexible PCB enhanced resistance
Now Si8000m and Si9000e also have a new option of XFE cross-modeling function, which Polar Instruments can provide. More than 98% of PCB manufacturers including Hongtai use Polar.
FPC soft board process introduction
Overview of FPC soft board automatic production line
Heavy copper PCB manufacturing
Just like the standard PCB manufacturing method, heavy copper PCB manufacturing requires more delicate processing.
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:
According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

HI-8585PSI Manufacturers

Related Products

Hot Products

XCKU035-1FFVA1156C

XC6VSX475T-2FF1156E

5AGXBA3D4F31C5G

5G Optical Module PCB

XCVU13P-2FLGA2577E

10 Layer 4Step HDI PCB

PCB proofing layout setting skills

High-precision multi-layer circuit board PCB proofing, four major production difficulties can not be ignored

Polar models flexible PCB enhanced resistance

FPC soft board process introduction

Heavy copper PCB manufacturing

According to the number of microelectronic devices integrated on a chip, integrated circuits can be divided into the following categories:

Chris Fountas 2020-09-01 12:01:19

Dolores 2020-09-20 11:25:58

Hazel 2021-07-14 22:25:39

Griselda 2024-10-05 00:54:40

Maureen 2021-01-14 14:00:37

Leona 2022-09-30 04:05:23

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.