HI-3593PQIF Manufacturers

XC2C128-7VQG100I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

​The 5CGXFC7C6F23I7N device integrates transceivers and hard memory controllers, suitable for industrial, wireless and wired, military, and automotive market applications

​XC6SLX150T-3FGG900I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.

​BCM56980B0KFSBG is a high-performance, high connectivity network switching device that can support up to 32 400GbE, 64 200GbE, or 128 100GbE switching ports.

Microstrip PCB refers to high-frequency PCB. For special circuit board with high electromagnetic frequency, generally speaking, high frequency board can be defined as frequency above 1GHz. The high frequency board comprises a core plate with a hollow groove and a copper clad plate bonded to the upper surface and the lower surface of the core board through flow glue. The edges of the upper opening and the lower opening of the hollow groove are provided with ribs.