EPM570F100I5N Manufacturers

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Hot Products

  • XCVU13P-L2FHGA2104E

    XCVU13P-L2FHGA2104E

    ​XCVU13P-L2FHGA2104E is a high-performance FPGA chip produced by Xilinx. This chip is based on the UltraScale+architecture, with excellent logic processing capabilities and high bandwidth IO interfaces, suitable for various high-performance computing and data processing scenarios
  • HI-8588PST

    HI-8588PST

    ​HI-8588PST is an ARINC 429 bus interface receiver with an SO 8-pin package, utilizing analog/digital CMOS technology.
  • XC9572XL-5TQ100C

    XC9572XL-5TQ100C

    ​XC9572XL-5TQ100C is a complex programmable logic device (CPLD) produced by Xilinx. The chip is packaged in TQFP-100 and has 100 pins, of which 72 are I/O pins. It supports a 3.3V power supply voltage and operates within a temperature range of 0 ℃ to 70 ℃.
  • ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • 5CEBA4U15I7N

    5CEBA4U15I7N

    ​5CEBA4U15I7N is an FPGA (Field Programmable Gate Array) chip produced by Intel (formerly Altera Corporation), belonging to the Cyclone V E series. This chip has the following key features
  • XC7A75T-2FGG484I

    XC7A75T-2FGG484I

    XC7A75T-2FGG484I is a field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 52,160 logic cells, 2.7 Mb of block RAM, and 240 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1000 MHz. The device comes in a fine-pitch ball grid array (FGG484I) package with 484 pins, providing high pin-count connectivity for a variety of applications. XC7A75T-2FGG484I is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for high-speed and high-reliability applications.

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