EPF10K10TI144-4N Manufacturers

We take "customer-friendly, quality-oriented, integrative, innovative" as objectives. "Truth and honesty" is our administration ideal for EPF10K10TI144-4N, We believe we'll become a leader in building and producing top quality merchandise in the two Chinese and international markets. We hope to cooperate with much more close friends for mutual gains.
EPF10K10TI144-4N, We have been in operation for more than 10 years. We have been dedicated to quality products and solutions and consumer support. We currently own 27 product utility and design patents. We invite you to visit our company for a personalized tour and advanced business guidance.

Hot Products

  • Large size sensor PCB

    Large size sensor PCB

    Large size sensor PCB--The sensor is a device to detect Du, which can sense the measured information, and can transform it into electrical signal or other required information output according to certain rules, so as to meet the requirements of information transmission, processing, storage, display, recording and control. It needs PCB, Large size sensor PCB to meet these requirements
  • GA102-850-A1

    GA102-850-A1

    GA102-850-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S250E-4TQG144C

    XC3S250E-4TQG144C

    XC3S250E-4TQG144C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
  • XC7Z010-2CLG225I

    XC7Z010-2CLG225I

    ​XC7Z010-2CLG225I Adopting a dual core ARM Cortex-A9 processor configuration, it integrates 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceivers), providing highly differentiated design for various embedded applications
  • XC3S2000-4FGG676C

    XC3S2000-4FGG676C

    XC3S2000-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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