EP4SGX110FF35C3G Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX4-2CPG196C

    XC6SLX4-2CPG196C

    XC6SLX4-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • High-power LED ceramic PCB

    High-power LED ceramic PCB

    High-power LED ceramic PCB--High-power LED copper-clad ceramic circuit board can effectively solve the heat dissipation problem of high-power LED thermal skew,Aluminum Nitride Ceramic base board substrate has the best overall performance and is the ideal substrate material for future high-power LEDs.
  • 10G optical module PCB

    10G optical module PCB

    In the era of rapid development of interconnected data and optical networks, 100G optical modules PCB , 200G optical modules PCB and even 400G optical modules PCB are constantly emerging. However, high speed has the advantages of high speed, and low speed also has the advantages of low speed. In the era of high-speed optical modules, 10G optical module PCB support the operations of manufacturers and users with their unique advantages and relatively low cost.10G optical module, as the name suggests, is an optical module that transmits 10G of data per second.According to inquiries: 10G optical modules are packaged in 300pin, XENPAK, X2, XFP, SFP+, and other packaging methods.
  • XC6SLX75-2FGG484I

    XC6SLX75-2FGG484I

    XC6SLX75-2FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU102-875-A1

    TU102-875-A1

    TU102-875-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCF16PFSG48C

    XCF16PFSG48C

    XCF16PFSG48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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