Products
Home > Products > EP4CE55F23I7N

EP4CE55F23I7N Manufacturers

We have been commitment to offer the aggressive value ,exceptional goods good quality, likewise as fast delivery for EP4CE55F23I7N, For anyone who is fascinated in any of our products and solutions, remember to come to feel totally free to get in touch with us for more facts. We hope to cooperate with additional good friends from everywhere in the world.
EP4CE55F23I7N, Our company offers the full range from pre-sales to after-sales service, from product development to audit the use of maintenance, based on strong technical strength, superior product performance, reasonable prices and perfect service, we are going to continue to develop, to offer the high-quality products and solutions and services, and promote lasting cooperation with our customers, common development and create a better future.

Related Products

Hot Products

  • TPD1E10B06DPYR

    TPD1E10B06DPYR

    TPD1E10B06DPYR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TPS3824-33DBVR

    TPS3824-33DBVR

    TPS3824-33DBVR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56376A2KFSBG

    BCM56376A2KFSBG

    BCM56376A2KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4S40GH40I2G

    EP4S40GH40I2G

    EP4S40GH40I2G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7A100T-1FGG676I

    XC7A100T-1FGG676I

    ​XC7A100T-1FGG676I is an FPGA chip produced by Xilinx, belonging to the Artix-7 series, with the following characteristics:
  • XC5VLX50T-3FFG665C

    XC5VLX50T-3FFG665C

    XC5VLX50T-3FFG665C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • FPC soft board process introduction

    Overview of FPC soft board automatic production line

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

  • Multilayer PCB Laminate Structure

    Before designing a multi-layer PCB circuit board, the designer needs to first determine the circuit board structure used according to the scale of the circuit, the size of the circuit board and the requirements of electromagnetic compatibility (EMC)

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • HDI board market supply and demand analysis

    The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

  • Introduction to semiconductor

    Germanium, silicon, selenium, gallium arsenide and many metal oxides, metal sulfides and other objects, whose conductivity is between conductor and insulator, are called semiconductors. Semiconductors have some special properties. For example, the thermistor (thermistor) for automatic control can be made by using the relationship between the resistivity and temperature of the semiconductor; Using its photosensitive characteristics, photosensitive elements for automatic control can be made, such as photocells, photocells and photoresistors

Send Inquiry