EP4CE30F29C6N Manufacturers

Our business has been focusing on brand strategy. Customers' pleasure is our best advertising. We also offer OEM company for EP4CE30F29C6N, Our main objectives are to provide our customers worldwide with good quality, competitive price, satisfied delivery and excellent services.
EP4CE30F29C6N, We have constructed strong and long co-operation relationship with an enormous quantity of companies within this business overseas. Immediate and specialist after-sale service supplied by our consultant group has happy our buyers. Detailed Info and parameters from the merchandise will probably be sent to you for any thorough acknowledge. Free samples may be delivered and company check out to our corporation. n Portugal for negotiation is constantly welcome. Hope to get inquiries type you and construct a long-term co-operation partnership.

Hot Products

  • XCVU29P-1FSGA2577E

    XCVU29P-1FSGA2577E

    ​XCVU29P-1FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale+series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control, and other fields. The XCVU29P-1FSGA2577E adopts advanced 20nm technology and is packaged in the form of 2577 pin FCBGA,
  • XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I

    XC7VX690T-1FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • AD8139ACPZ

    AD8139ACPZ

    AD8139ACPZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX230KF40I4N

    EP4SGX230KF40I4N

    EP4SGX230KF40I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 13 layer R5775G high-speed PCB

    13 layer R5775G high-speed PCB

    In the design of 13 layer R5775G high-speed PCB, the main problems that must be considered are signal integrity, electromagnetic compatibility and thermal noise. Generally, when the signal frequency is higher than 30MHz, the signal distortion must be prevented. When the frequency is higher than 66MHz, the signal integrity must be analyzed.
  • MT41K128M16JT-107:K

    MT41K128M16JT-107:K

    MT41K128M16JT-107:K is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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