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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • EP3SL110F780C3G

    EP3SL110F780C3G

    ​EP3SL110F780C3G is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 110,000 Logic Elements, operates at a speed of up to 660 MHz, and features 4.6 Mb of embedded memory, 172 DSP blocks, and 12 high-speed transceiver channels.
  • XC2C384-10TQG144I

    XC2C384-10TQG144I

    XC2C384-10TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-1FLGC2104I

    XCVU9P-1FLGC2104I

    ​XCVU9P-1FLGC2104I is an FPGA (Field Programmable Gate Array) chip, specifically belonging to Xilinx's product line. Here is a brief introduction to the chip:
  • XC9572XL-10VQG64C

    XC9572XL-10VQG64C

    ​XC9572XL-10VQG64C is a complex programmable logic device (CPLD) produced by Xilinx. The chip is packaged in VQFP-64 and has 64 pins, of which 52 are I/O pins. It has built-in flash memory, supports system programmability, and has a maximum clock frequency of up to 100 MHz,
  • 10CL055YF484I7G

    10CL055YF484I7G

    ​10CL055YF484I7G The Intel Cyclone 10 LP equipment is divided into commercial grade, industrial grade, extended industrial grade, and automotive grade.
  • XC3S250E-4TQG144I

    XC3S250E-4TQG144I

    XC3S250E-4TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • HDI board market supply and demand analysis

    The continuous growth of mobile phone production is driving the demand for HDI boards. China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards have adopted HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.

  • Aren't chips and semiconductors the same thing?

    Beginners may be confused by the terms "chip" and "semiconductor" and cannot distinguish their relationship. Today, Hongtai Express Electronics will focus on sorting out the connections and differences between chips and semiconductors that we often talk about.

  • The Evolution and Impact of Integrated Circuits in Modern Electronics

    The concept of integrated circuits traces its roots back to the late 1950s and early 1960s. Jack Kilby, an engineer at Texas Instruments, and Robert Noyce, co-founder of Fairchild Semiconductor and later Intel, independently conceived the idea of integrating multiple electronic components onto a single semiconductor substrate.

  • Main manufacturing technology of Multilayer PCB printed circuit board

    In 1936, Austrian Paul Eisler first used printed circuit board in radio. In 1943, Americans mostly applied this technology to military radios. In 1948, the United States officially recognized that this invention can be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

  • Foxconn changes cage to Phoenix and wants to regain market with 8K

    Guo Taiming described its acquisition of Sharp and the introduction of 8K display technology as a replacement for the phoenix. Whether this phoenix can bring Guo Taiming the expected growth and prompt Foxconn to regain the market is still to be verified.

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