EP3C16F256I7N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCZU21DR-2FFVD1156I

    XCZU21DR-2FFVD1156I

    Overview of XCZU21DR-2FFVD1156I RF Data Converter Subsystem Most Zynq UltraScale+RFSoCs include an RF data converter subsystem that includes multiple radios Frequency analog-to-digital converter (RF-ADC) and multiple RF analog-to-digital converters Converter (RF-DAC). High precision, high-speed, and energy-efficient RF-ADC and RF-DAC Can be configured separately for real data, or in most cases can be configured in pairs for real and imaginary numbers
  • 10M02SCM153I7G

    10M02SCM153I7G

    ​10M02SCM153I7G is an FPGA (Field Programmable Gate Array) produced by Intel and belongs to the MAX 10 series. ‌ The main features of this FPGA include:
  • XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 digital signal processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGB2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • EP4SGX230KF40I4N

    EP4SGX230KF40I4N

    EP4SGX230KF40I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC95144XL-7TQG144I

    XC95144XL-7TQG144I

    XC95144XL-7TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTM4613IV#PBF

    LTM4613IV#PBF

    LTM4613IV#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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