EP1S20F672C7N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCZU4CG-2FBVB900I

    XCZU4CG-2FBVB900I

    XCZU4CG-2FBVB900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Hard gold PCB

    Hard gold PCB

    Hard gold PCB--plating gold can be divided into hard gold and soft gold. Because the hard gold plating is an alloy, the hardness is relatively hard. It is suitable for use in places where friction is required. It is generally used as a contact point on the edge of the PCB (commonly known as gold fingers).The following is about Hard gold plated PCB related, I hope to help you better understand Hard gold plated PCB.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU060-1FFVA1156I

    XCKU060-1FFVA1156I

    XCKU060-1FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • PM-DB2745L+

    PM-DB2745L+

    ​The introduction of PM-DB2745L+may vary depending on specific product specifications, manufacturers, and application scenarios. However, based on the search results I found, I can provide some general information about PM-DB2745L (note that information about PM-DB2745L+was not directly found, but usually the "+" in the model may indicate some variant or upgraded version):
  • HI-3584APQT-15

    HI-3584APQT-15

    ​The features of HI-3584APQT-15 include ARINC 429 compatibility, high-speed 3.3V logic interface, offering 9mm x 9mm small chip level packaging, and dual receiver and transmitter interfaces. ‌

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