EP1K50FC256-3N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A15T-2FTG256I

    XC7A15T-2FTG256I

    XC7A15T-2FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Bluetooth Module HDI PCB

    Bluetooth Module HDI PCB

    Bluetooth module is a PCBA board with integrated Bluetooth function for short-range wireless communication. It is divided into Bluetooth data module and Bluetooth voice module by function.The following is about Bluetooth Module HDI PCB related, I hope to help you better understand Bluetooth Module HDI PCB.
  • XCR3128XL-10VQG100C

    XCR3128XL-10VQG100C

    XCR3128XL-10VQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB is pressed 3-6 layers first, then 2 and 7 layers are added, and finally 1 to 8 layers are added, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XC5VSX95T-1FFG1136I

    XC5VSX95T-1FFG1136I

    ​XC5VSX95T-1FFG1136I is a high-performance FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex-5 SXT series

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