Capacitive screen FPC Manufacturers

Our rewards are lessen selling prices,dynamic sales team,specialized QC,solid factories,high quality services for Capacitive screen FPC,Foot Touch FPC,Medical equipment FPC,AP8555R FPC,AP8565R FPC, "Making the Merchandise of Significant Quality" could be the eternal goal of our firm. We make unremitting endeavours to know the aim of "We Will Always Keep in Pace using the Time".
Capacitive screen FPC, We are sticking to excellent quality, competitive price and punctual delivery and better service, and sincerely hope to establish long-term good relationships and cooperation with our new and old business partners from all over the world. Sincerely welcome you to join us.

Hot Products

XA7S6-1CSGA225I
XA7S6-1CSGA225I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XCVU095-1FFVB2104I
XCVU095-1FFVB2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Kintex UltraScale series. This chip adopts advanced 20nm process technology, providing maximum performance and integration, especially suitable for applications in high-performance computing, network communication, data centers, and AI fields. Here are some detailed introductions about XCVU095-1FFVB2104I
Heavy copper PCB
Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
HI-8448PCTF-10
he HI-8448PCTF-10 is an octal ARINC 429 line receiver IC designed for use in demanding aviation electronics applications. It features eight independent receiver channels that convert incoming ARINC 429 data bus signals into a pair of complementary Metal-Oxide-Semiconductor (CMOS)/Transistor-Transistor Logic (TTL) outputs.
EP4CGX30CF23C7N
EP4CGX30CF23C7N is a Cyclone IV GX series FPGA chip produced by Intel (formerly Altera). The chip has 1840 LAB/CLBs, 29440 logic elements/units, and 290 I/O ports, supporting high-speed data processing and flexible logic configuration. It is packaged in 484-FBGA,
XA7A75T-1FGG484Q
The XA7A75T-1FGG484Q FPGA field programmable gate array device is based on the most advanced high-performance/low-power (HPL) 28nm high-k metal gate (HKMG) process technology, and the XA Artix-7 FPGA redefines low-cost alternatives with more logic per watt.

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Capacitive screen FPC Manufacturers

Related Products

Hot Products

XA7S6-1CSGA225I

XCVU095-1FFVB2104I

Heavy copper PCB

HI-8448PCTF-10

EP4CGX30CF23C7N

XA7A75T-1FGG484Q

"Electronic Manufacturing Pavilion" of Shenzhen Electronic Equipment Association will become the new highlight of CITE2017

Why HDI PCB needs to be browned and what is its function？

Development layout of FPC flexible board industry and development trend of domestic and foreign markets

What skills are required for PCB proofing

2017 Hongtai bids farewell to Shenzhen to settle in the Fourth Guangdong Association

Microprocessor vs. Integrated Circuit in Electronics Design

Rae 2020-10-19 23:22:14

Madeline 2022-01-27 07:17:14

Judy 2021-01-07 17:24:13

Frances 2020-07-28 06:29:12

Pamela 2022-02-17 10:33:23

Miriam 2024-03-30 22:23:27

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.