Capacitive screen FPC Manufacturers

Our rewards are lessen selling prices,dynamic sales team,specialized QC,solid factories,high quality services for Capacitive screen FPC,Foot Touch FPC,Medical equipment FPC,AP8555R FPC,AP8565R FPC, "Making the Merchandise of Significant Quality" could be the eternal goal of our firm. We make unremitting endeavours to know the aim of "We Will Always Keep in Pace using the Time".
Capacitive screen FPC, We are sticking to excellent quality, competitive price and punctual delivery and better service, and sincerely hope to establish long-term good relationships and cooperation with our new and old business partners from all over the world. Sincerely welcome you to join us.

Hot Products

XC7A50T-1CPG236I
XC7A50T-1CPG236I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
EP1S25F672C7N
EP1S25F672C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC7K325T-2FFG676I
The XC7K325T-2FFG676I field programmable gate array, after optimization, has the best cost-effectiveness, which is twice as high as the previous generation product, realizing a new type of FPGA.
EP3SE110F1152I3N
EP3SE110F1152I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
GA100-895FF-A1
GA100-895FF-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
STM32F745ZGT6
STM32F745ZGT6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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Heavy copper PCBs are manufactured with 4 ounces or more of copper on each layer. 4 ounce copper PCBs are most commonly used in commercial products. The concentration of copper can be as high as 200 ounces per square foot.

Capacitive screen FPC Manufacturers

Related Products

Hot Products

XC7A50T-1CPG236I

EP1S25F672C7N

XC7K325T-2FFG676I

EP3SE110F1152I3N

GA100-895FF-A1

STM32F745ZGT6

Qualcomm Huawei competes for 5G standard: the same day announced the completion of 5G connection under the new specification

What is an integrated circuit?

C919 Chinese people just made a shell? Let's see what the insiders say

PCB factory Jianding is aggressively attacking the automotive board market and plans to spend 3 billion yuan to expand the capacity of the Hubei Xiantao plant

Foxconn changes cage to Phoenix and wants to regain market with 8K

Understand the structure of heavy copper PCB

Rae 2020-10-19 23:22:14

Madeline 2022-01-27 07:17:14

Judy 2021-01-07 17:24:13

Frances 2020-07-28 06:29:12

Pamela 2022-02-17 10:33:23

Miriam 2024-03-30 22:23:27

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.