Brand: xilinx Operating temperature: -40℃ ~ 100℃ Number of stitches: 2104 Manufacturers

6-layers 2Step HDI PCB Laminate twice. Take an eight-layer circuit board with blind/buried vias as an example. First, laminate layers 2-7, first make elaborate blind/buried vias, and then laminate layer 1 and 8 layers to make well-made vias .The following is about6 layers 2Step HDI, I hope to help you better understand 6 layers 2Step HDI.

BCM6715XB0KRFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​5CSEBA4U23I7N is a SoC FPGA (Field Programmable Gate Array) produced by Altera, which has high performance and rich functional features. Here is a detailed introduction about 5CSEBA4U23I7N:

BCM957414A4142CC is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

PI6C4931502-04LIE is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.