Brand: xilinx Operating temperature: -40℃ ~ 100℃ Number of stitches: 2104 Manufacturers

"Sincerity, Innovation, Rigorousness, and Efficiency" may be the persistent conception of our organization to the long-term to build together with shoppers for mutual reciprocity and mutual advantage for Brand: xilinx Operating temperature: -40℃ ~ 100℃ Number of stitches: 2104,Model: XCVU9P-2FLGB2104I,Quantity: 320pcs,Batch: 2023+, Accurate process devices, Advanced Injection Molding Equipment, Equipment assembly line, labs and software growth are our distinguishing feature.
Brand: xilinx Operating temperature: -40℃ ~ 100℃ Number of stitches: 2104, Our goods are sold to the Middle East, Southeast Asia, Africa, Europe, America and other regions, and are favorably appraised by clients. To benefit from our strong OEM/ODM capabilities and considerate services, you should contact us today. We are going to sincerely create and share success with all clients.

Hot Products

  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E

    XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • XC7K70T-3FBG676E

    XC7K70T-3FBG676E

    XC7K70T-3FBG676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S250E-4PQG208I

    XC3S250E-4PQG208I

    XC3S250E-4PQG208I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • GA102-895-A1

    GA102-895-A1

    GA102-895-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • LTM4613IV#PBF

    LTM4613IV#PBF

    LTM4613IV#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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