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BGA, Regarding quality as survival, prestige as guarantee, innovation as motive force, development along with advanced technology, our group hopes to make progress together with you and make untiring efforts for the bright future of this industry.

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    XCVU5P-1FLVA2104E

    ​XCVU5P-1FLVA2104E is an FPGA (Field Programmable Gate Array) product launched by Xilinx. This FPGA integrates multiple high-performance features designed to meet various complex computing and application requirements. Here are some key features and specifications about XCVU5P-1FLVA2104E
  • XCKU15P-3FFVE1517E

    XCKU15P-3FFVE1517E

    ​XCKU15P-3FFVE1517E Kintex® UltraScale+ ™ FPGA provides high cost-effectiveness in FinFET nodes, offering an economical and efficient solution for applications that require high-end functionality, including 33Gb/s transceivers and 100G connectivity cores.
  • XC7VX690T-1FFG1927I

    XC7VX690T-1FFG1927I

    XC7VX690T-1FFG1927I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX25-3FTG256C

    XC6SLX25-3FTG256C

    XC6SLX25-3FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU49DR-2FFVF1760I

    XCZU49DR-2FFVF1760I

    ​XCZU49DR-2FFVF1760I is a powerful and high-performance SoC FPGA chip. It has the following characteristics and advantages:
  • BCM82380BKFSBG

    BCM82380BKFSBG

    BCM82380BKFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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  • Polar models enhanced resistance for flexible PCBs

    Now Si8000m and Si9000e also have the new option of XFE cross modeling function, Polar Instruments can provide. More than 98% of PCB manufacturers including Hongtai use Polar.

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    According to the number of layers, single-sided, double-sided and multilayer circuit boards are divided according to the circuit layer inside.

  • High Frequency PCB processing attention points

    High Frequency PCB processing attention points.

  • What does a chip mean

    A chip refers to a silicon chip containing integrated circuits, which is small in size and is a part of a mobile phone, computer, or other electronic device. If the most important organ of the human body is the brain, then chips are the "brain" of electronic devices.

  • What does a chip mean

    A chip refers to a silicon chip containing integrated circuits, which is small in size and is a part of a mobile phone, computer, or other electronic device. If the most important organ of the human body is the brain, then chips are the "brain" of electronic devices. A chip is an integrated circuit, also known as a microelectronic chip, composed of many electronic devices, circuit components, organic matter, etc., packaged on a single silicon chip, and is one of the foundations of modern electronic technology. Because of its small size, low power consumption, high manufacturing difficulty, and high reliability

  • Design steps of multilayer circuit board

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