BCM957414N4140C Manufacturers

XC3S1000-4FGG456I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

BCM5337MKQMG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.

XC7VX485T-2FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

XCVU13P-2FHGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 1.3 million logic cells, 50 Mb of block RAM, and 624 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-performance computing, machine vision, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 1 GHz. The device comes in a flip-chip BGA (FHGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU13P-2FHGB2104E is commonly used in advanced systems such as wireless communications, cloud computing, and high-speed networking. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.

XCZU25DR-1FFVG1517E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.