BCM88271CA1KFSBG Manufacturers

We also offer product sourcing and flight consolidation services. We have our own factory and sourcing office. We can provide you with almost every type of product related to our product range for BCM88271CA1KFSBG, Welcome all customers of property and abroad to go to our organization, to forge a fantastic long run by our cooperation.
BCM88271CA1KFSBG, We rely on high-quality materials, perfect design, excellent customer service and the competitive price to win the trust of many customers at home and abroad. 95%products are exported to overseas markets.

Hot Products

  • MT28EW128ABA1HPN-0SIT

    MT28EW128ABA1HPN-0SIT

    MT28EW128ABA1HPN-0SIT is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S200-5PQG208C

    XC2S200-5PQG208C

    XC2S200-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCZU27DR-2FFVE1156I

    XCZU27DR-2FFVE1156I

    ​XCZU27DR-2FFVE1156I integrates a single chip direct RF sampling data converter on an adaptive SoC, eliminating the need for external data converters, thus achieving a highly flexible solution. Compared with multi-component solutions, this solution can reduce power consumption and space occupation by 50%, including eliminating high power FPGA analog interfaces such as JESD204
  • XCKU15P-L2FFVA1156E

    XCKU15P-L2FFVA1156E

    XCKU15P-L2FFVA1156E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Rogers 4350B PCB

    Rogers 4350B PCB

    The high-frequency mixed-press printed circuit board includes an aluminum base layer and an insulating and thermally conductive layer. The circuit board is provided with mounting holes. The bottom of the aluminum base layer is bonded and connected to the carbon cladding through a silicon rubber layer. The aluminum base layer, the insulating and thermally conductive layer, and the silicon rubber layer A rubber layer is adhesively connected to the outer end of the carbon cladding, and kraft paper is bonded to the bottom of the carbon cladding, which can prevent moist moisture from contaminating it, avoiding it from being eroded, saving costs, and improving efficiency. The following is about Rogers 4350B PCB related, I hope to help you better understand Rogers 4350B PCB.
  • BCM6753A1KFEBG

    BCM6753A1KFEBG

    BCM6753A1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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