BCM68658A1IFSBG Manufacturers

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Hot Products

  • XCZU4EG-2FBVB900I

    XCZU4EG-2FBVB900I

    ​XCZU4EG-2FBVB900I is an FPGA programmable logic device chip launched by Xilinx. This chip belongs to the Virtex-6 series and has the characteristics of high performance and high integration, suitable for various complex application scenarios
  • LT8390IUFD#PBF

    LT8390IUFD#PBF

    LT8390IUFD#PBF also provides input or output current monitoring and power good indication, supporting the adjustment of output voltage and input or output current within the input voltage range of 4V to 60V.
  • XCKU15P-1FFVE1517I

    XCKU15P-1FFVE1517I

    XCKU15P-1FFVE1517I is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 287,200 logic cells, 8.5 Mb of distributed RAM, 360 Digital Signal Processing (DSP) slices, and 960 user input/output pins. It operates on a 0.95V to 1.05V power supply and supports various I/O standards such as LVCMOS, HSTL, and PCI Express.
  • XC3S200AN-4FT256C

    XC3S200AN-4FT256C

    XC3S200AN-4FT256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Buried Copper Coin PCB

    Buried Copper Coin PCB

    The so-called Buried Copper Coin PCB is a PCB board in which a copper Coin is partially embedded on the PCB. The heating elements are directly attached to the surface of the copper Coin board, and the heat is transferred out through the copper Coin.
  • XC7V585T-2FFG1761I

    XC7V585T-2FFG1761I

    ​XC7V585T-2FFG1761I has been optimized for the highest system performance and capacity, resulting in a 2x increase in system performance. The highest performance device using stacked silicon interconnect (SSI) technology.

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