BCM6710A1KFFBG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC6SLX16-2CSG324I

    XC6SLX16-2CSG324I

    XC6SLX16-2CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z020-2CLG400E

    XC7Z020-2CLG400E

    ​XC7Z020-2CLG400E is an FPGA SoC (Field Programmable Gate Array with System on a Chip) produced by AMD/Xilinx, also known as Programmable Logic Integrated Circuit. This product has the following features and specifications:
  • XCVU11P-1FLGB2104I

    XCVU11P-1FLGB2104I

    XCVU11P-1FLGB2104I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56150A0KFSBLG

    BCM56150A0KFSBLG

    BCM56150A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Multilayer precision PCB

    Multilayer precision PCB

    Multilayer precision PCB--The manufacturing method of multilayer board is generally made by the inner layer pattern first, and then the single or double-sided substrate is made by printing and etching method, which is included in the specified interlayer, and then heated, pressurized and bonded. As for the subsequent drilling, it is the same as the plating through-hole method of double-sided board.
  • XC7S50-1FTGB196I

    XC7S50-1FTGB196I

    XC7S50-1FTGB196I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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