BCM65238C0IFSBG Manufacturers

Our development depends on the advanced equipment, excellent talents and continuously strengthened technology forces for BCM65238C0IFSBG, For high-quality gas welding & cutting equipment supplied on time and at the right value, you can count on organization name.
BCM65238C0IFSBG, Customer satisfaction is our goal. We're looking forward to cooperating with you and providing our best services in your case. We warmly welcome you to contact us and remember to feel free to contact us. Browse our online showroom to see what we can do for yourself. And then E-mail us your specifications or inquiries today.

Hot Products

  • BCM82790BIFSBG

    BCM82790BIFSBG

    BCM82790BIFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Multilayer layers HDI PCB

    Multilayer layers HDI PCB

    Multilayer layers HDI PCB, press 3-6 layers first, then add 2 and 7 layers, and finally add 1 to 8 layers, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C

    XC6SLX45T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU5P-1FLVB2104I

    XCVU5P-1FLVB2104I

    ​XCVU5P-1FLVB2104I is an FPGA chip produced by Xilinx, belonging to the UltraScale+series. This chip integrates up to 1.5 million system logic units and utilizes second-generation 3D integrated circuit technology to integrate multiple PCI Express Gen3 cores, improving system performance
  • 16-layer Rigid-Flex PCB

    16-layer Rigid-Flex PCB

    The designer of 16-layer Rigid-Flex PCB can use a single component to replace the composite printed circuit board which is composed of multiple connectors, multiple cables and ribbon cables. The performance is stronger and the stability is higher. At the same time, the scope of design is limited to one component, and the available space is optimized by bending and folding lines like a paper swan.
  • XC6SLX9-2CSG324I

    XC6SLX9-2CSG324I

    ​XC6SLX9-2CSG324I, Field Programmable Gate Array (FPGA), 9152 Cells, 45nm (CMOS) Technology, 1.2V, produced by Xilinx factory, CSBGA-324 package

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