Products
Home > Products > BCM5719A1KFBG

BCM5719A1KFBG Manufacturers

We always think and practice corresponding to the change of circumstance, and grow up. We goal at the achievement of a richer mind and body and also the living for BCM5719A1KFBG, For additional facts, please make contact with us as shortly as possible!
BCM5719A1KFBG, Aiming to grow to be by far the most professional supplier within this sector in Uganda, we keep researching on the creating procedure and raising the high quality of our principal products. Till now, the merchandise list has been updated on a regular basis and attracted customers from around the globe. In depth data can be obtained in our web page and you'll be served with good quality consultant service by our after-sale team. They're planning to let you to get complete acknowledge about our goods and make a satisfied negotiation. Small business check out to our factory in Uganda can also be welcome at any time. Hope to obtain your inquiries to get a happy co-operation.

Related Products

Hot Products

  • XCVU440-2FLGA2892E

    XCVU440-2FLGA2892E

    XCVU440-2FLGA2892E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7S75-1FGGA676I

    XC7S75-1FGGA676I

    ​XC7S75-1FGGA676I is a Xilinx chip belonging to the Spartan-7 series, manufactured using 28 nanometer technology. It is a field programmable logic array (FPGA) chip with various excellent features. XC7S75-1FGGA676I is equipped with MicroBlaze ™ A soft processor that can achieve performance of over 200 DMIPs and support DDR3 at 800Mb/s.
  • BCM54991ELB0IFEBG

    BCM54991ELB0IFEBG

    BCM54991ELB0IFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXMA4H3F35C4G

    5SGXMA4H3F35C4G

    ​5SGXMA4H3F35C4G is an FPGA field programmable gate array belonging to the Altera brand, with a packaging type of FBGA-1152. This product has the following characteristics and specifications:
  • UAV PCB

    UAV PCB

    UAV PCB has become one of the biggest hot spots in the exhibition. DJI, Parrt, 3D rbtics, airdg and other well-known UAV companies have displayed their latest products. Even Intel and Qualcomm's booths display aircraft with powerful communication functions that can automatically avoid obstacles.
  • BCM53125SKMMLG

    BCM53125SKMMLG

    BCM53125SKMMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Related Blog
  • Reviews

  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • How to design the Rigid-Flex PCB better?

    With the continuous upgrading of electronic products and the gradual application of 5G products, the demand for Rigid-Flex PCB has increased. There is a big difference between designing Rigid-Flex PCB and simply designing Flex-PCB and Rigid-PCB.The following is a detailed description of some requirements for the design of conventionalRigid-Flex PCB.

  • What is a semiconductor

    If the substance is distinguished by conductivity, it can be roughly classified into two types

  • Huawei Yu Chengdong: P10 sales to break 10 million to catch up with Apple

    At present, the dividend ceiling of smart phones is gradually emerging, especially the competition in the Chinese market is particularly fierce. In January, Huawei's sales were 4.72 million units, a slight decrease of 0.4%, and sales were 10.89 billion yuan, a decrease of 1.5%.

  • Definition and cause of pink circle on circuit board PCB

    After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

Send Inquiry