BCM54991EB0KFSBG Manufacturers

All we do is usually connected with our tenet " Client very first, Belief first, devoting about the food stuff packaging and environmental security for BCM54991EB0KFSBG, As we're moving forward, we maintain an eye on our ever-expanding item range and make improvement to our expert services.
BCM54991EB0KFSBG, Since the establishment of our company, we have realized the importance of providing good quality products and the best before-sales and after-sales services. Most problems between global suppliers and clients are due to poor communication. Culturally, suppliers can be reluctant to question things they do not understand. We break down those barriers to ensure you get what you want to the level you expect, when you want it.

Hot Products

  • EPM570T100A5N

    EPM570T100A5N

    EPM570T100A5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56540XB0IFSBLG

    BCM56540XB0IFSBLG

    BCM56540XB0IFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-3FFG1157I

    XC7VX690T-3FFG1157I

    XC7VX690T-3FFG1157I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VSX475T-2FF1156E

    XC6VSX475T-2FF1156E

    ​XC6VSX475T-2FF1156E Package BGA Integrated Circuit Chip IC Electronic Component Inquiry and Order
  • XCVU9P-2FLGA2104E

    XCVU9P-2FLGA2104E

    XCVU9P-2FLGA2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 Digital Signal Processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGA2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGA2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • EP3C55F484I7N

    EP3C55F484I7N

    EP3C55F484I7N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 55,000 Logic Elements, operates at a speed of up to 350 MHz, and features 360Kb of embedded memory, 204 DSP blocks, and 4 PLLs. It is commonly used in a range of applications, including motor control, sensory data aggregation, and low-power embedded processing.

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