BCM53426A0KFSBG Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • Multilayer Ceramic PCB

    Multilayer Ceramic PCB

    Multilayer Ceramic PCB substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The following is about Multilayer Ceramic Circuit Board related, I hope to help you better understand Multilayer Ceramic Circuit Board PCB.
  • XC7A200T-L2FBG676E

    XC7A200T-L2FBG676E

    ​XC7A200T-L2FBG676E is an Artix-7 series FPGA chip produced by Xilinx, featuring high performance and low power consumption.
  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5G test PCB

    5G test PCB

    Most of 5g products need 5g test PCB, which can be used normally after debugging. Therefore, 5g test PCB has become a popular product. Hontec specializes in producing communication PCB.
  • XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I

    XC3S50AN-4TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10CL080YF780I7G

    10CL080YF780I7G

    ​10CL080YF780I7G is an FPGA (Field Programmable Gate Array) product produced by Intel. It has 423 I/O ports, packaged in 780-BGA (ball grid array), with a working voltage of 1.2V and a working temperature range of -40 ° C to 100 ° C.

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