ADuM5402CRWZ Manufacturers

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ADuM5402CRWZ, With high quality, reasonable price, on-time delivery and customized & customized services to help customers achieve their goals successfully, our company has got praise in both domestic and foreign markets. Buyers are welcome to contact us.

Hot Products

  • MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B

    MT53E1G32D2FW-046WT:B is a type of DDR4 SDRAM module. It has a total capacity of 8GB and uses a 288-pin form factor. This module operates at a speed of 2400MHz and has a CAS latency of 17 clock cycles
  • XC6SLX75T-3FGG484C

    XC6SLX75T-3FGG484C

    XC6SLX75T-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.XC6SLX75T-3FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A200T-1SBG484C

    XC7A200T-1SBG484C

    XC7A200T-1SBG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU15EG-3FFVB1156E

    XCZU15EG-3FFVB1156E

    ​XCZU15EG-3FFVB1156E is an FPGA (Field Programmable Gate Array) developed by Xilinx based on Zynq UltraScale+MPSoC architecture. It integrates high-performance computing cores and rich I/O interfaces, supports multiple high-speed data transmission and communication protocols, and is widely used in high-performance computing,
  • 6-layers 2Step HDI PCB

    6-layers 2Step HDI PCB

    6-layers 2Step HDI PCB Laminate twice. Take an eight-layer circuit board with blind/buried vias as an example. First, laminate layers 2-7, first make elaborate blind/buried vias, and then laminate layer 1 and 8 layers to make well-made vias .The following is about6 layers 2Step HDI, I hope to help you better understand 6 layers 2Step HDI.
  • BCM84074AIFSBLG

    BCM84074AIFSBLG

    BCM84074AIFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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