Products
Home > Products > AD102-300-A1

AD102-300-A1 Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Related Products

Hot Products

  • XC7S75-1FGGA484C

    XC7S75-1FGGA484C

    Xilinx XC7S75-1FGGA484C Spartan ® -7 Field Programmable Gate Array adopts MicroBlaze with operating frequency exceeding 200DMIP ™ Soft processor, supporting 800Mb/s DDR3, based on 28nm technology. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system
  • XC7Z010-3CLG225E

    XC7Z010-3CLG225E

    XC7Z010-3CLG225E is an FPGA (Field Programmable Gate Array) chip based on ARM Cortex-A9 processor launched by Xilinx. This chip integrates SoC (System on a Chip) architecture, which has the characteristics of high performance and high flexibility
  • MT25QL256ABA8E12-0AAT

    MT25QL256ABA8E12-0AAT

    MT25QL256ABA8E12-0AAT serial NOR flash memory has a low number of pins, is simple and easy to use, and is a simple solution suitable for encoding shadow applications; Can meet the needs of consumer electronics, industry, wired communication, and computing applications. This device adopts industry standard packaging, pin allocation, command set and chipset compatibility, making it easy to adopt in various designs. This can save valuable development time while ensuring compatibility with existing and future designs.Product specifications:
  • XCZU9EG-2FFVB1156I

    XCZU9EG-2FFVB1156I

    XCZU9EG-2FFVB1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • HI-3210PCIF

    HI-3210PCIF

    The HI-3210PCIF is a highly integrated data management engine designed specifically for ARINC 429 communication. It features eight ARINC 429 receive channels and four ARINC 429 transmit channels, enabling efficient data transfer between avionics systems
  • XC7A50T-1FGG484I

    XC7A50T-1FGG484I

    ​XC7A50T-1FGG484I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • Related Blog
  • Reviews

  • Non-Apple HDI Big Release

    According to market reports, Huawei and other non-Apple flagship HDI expanded release orders, which will add momentum to the PCB factory's off-season operations in the first quarter of this year.

  • What does a chip mean

    A chip refers to a silicon chip containing integrated circuits, which is small in size and is a part of a mobile phone, computer, or other electronic device. If the most important organ of the human body is the brain, then chips are the "brain" of electronic devices.

  • Do you know these common costs in PCB enterprise management?

    In a certain period of time, enterprises will encounter the bottleneck of development. The operating cost has been rising, but it is difficult to find the "location" of the cost. We call it "invisible cost". 1. Meeting cost

  • The Development History of Semiconductors

    Semiconductor is the foundation of modern electronic technology, and its development can be traced back to the late 19th century. This article will introduce the development history of semiconductors and explore their importance to modern technology.

  • Precautions for processing covering film of FPC circuit board

    The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.

  • Why should PCB be cleaned?

    When troubleshooting non-functional or poorly performing circuits, engineers can usually run simulations or other analysis tools to consider the circuit from the schematic level.

Send Inquiry