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Adhering into the theory of "quality, services, efficiency and growth", now we have gained trusts and praises from domestic and international shopper for XILXIN,XQR5VFX130-1CN1752V,FCBGA-1752, Our really specialized process eliminates the component failure and offers our shoppers unvarying top quality, allowing us to control cost, plan capacity and maintain consistent on time delivery.
XILXIN, With a wide range, good quality, reasonable prices and stylish designs, our goods are extensively used in beauty and other industries. Our items are widely recognized and trusted by users and can meet continuously changing economic and social needs.

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    BCM65936A0IFSBG

    BCM65936A0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-1FHGA2104I

    XCVU13P-1FHGA2104I

    XCVU13P-1FHGA2104I ​Firstly, the XCVU13P series is likely to be part of the Virtex UltraScale+FPGA (Field Programmable Gate Array) series produced by AMD/Xilinx. FPGA is a semi custom integrated circuit that can be programmed and reconfigured by users after manufacturing to achieve specific logic functions.
  • 10AS048E4F29E3SG

    10AS048E4F29E3SG

    10AS048E4F29E3SG is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 48,000 Logic Elements, operates at a speed of up to 1 GHz, and features 302,400 bits of embedded memory, 1,512 DSP blocks, and 24 transceiver channels.
  • XC7Z010-1CLG400I

    XC7Z010-1CLG400I

    XC7Z010-1CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6VLX75T-2FFG484I

    XC6VLX75T-2FFG484I

    XC6VLX75T-2FFG484I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip adopts FCBGA packaging, which has high performance and flexibility, and is widely used in communication, data processing, image processing and other fields. Its main features include rich logical units and I/O resources
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  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • What is PCB? What is the history and development trend of PCB design?

    Printed circuit board (PCB), also known as printed circuit board. It is not only the carrier of electronic components in electronic products, but also the provider of circuit connection of electronic components. The traditional circuit board uses the method of printing etchant to make the circuit and drawing, so it is called printed circuit board or printed circuit board.

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    The main function of a chip is to complete calculations and processing tasks, and an integrated circuit is to package a circuit onto a small component.

  • FPC flexible circuit board through hole mode

    At present, most of the holes drilled in the double-sided flexible printed board are still drilled by the NC drilling machine. The NC drilling machine is basically the same as that used in the rigid printed board, but the drilling conditions are different. Because the flexible printed board is very thin, multiple pieces can be overlapped for drilling. If the drilling conditions are good, 10 ~ 15 pieces can be overlapped for drilling.

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    After the covering film of FPC circuit board is positioned, it is necessary to heat and pressurize to make the adhesive completely solidified and integrated with the circuit.

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    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

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