TU-883Sp PCB Manufacturers

In the past few years, our company absorbed and digested advanced technologies both at home and abroad. Meanwhile, our company staffs a team of experts devoted to the development of TU-883Sp PCB,TUC Rigid-Flex PCB,TUC High-speed PCB,TU-752 Rigid-Flex PCB,TU-862HF Halogen-free PCB, Now we have a skilled team for international trade. We will solve the problem you meet. We can present the goods you want. Be sure to feel cost-free to contact us.
TU-883Sp PCB, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

Hot Products

  • XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C

    XC7V585T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Multilayer layers HDI PCB

    Multilayer layers HDI PCB

    Multilayer layers HDI PCB, press 3-6 layers first, then add 2 and 7 layers, and finally add 1 to 8 layers, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XCZU9CG-2FFVC900I

    XCZU9CG-2FFVC900I

    ​XCZU9CG-2FFVC900I is a high-performance FPGA chip launched by Xilinx, which integrates rich functions and powerful performance, suitable for various complex application scenarios. Here are some of the main features and functions of the chip:
  • XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I

    XC7VX485T-2FFG1157I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC2C128-7CPG132I

    XC2C128-7CPG132I

    XC2C128-7CPG132I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2S30F484I4N

    EP2S30F484I4N

    EP2S30F484I4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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