TU-752 High-speed PCB Manufacturers

As for aggressive selling prices, we believe that you will be searching far and wide for anything that can beat us. We are able to state with absolute certainty that for such good quality at such costs we've been the lowest around for TU-752 High-speed PCB,TU-863 PCB,TUC High-speed PCB,TU-863+ PCB,TU-933E PCB, You would not have any communication problem with us. We sincerely welcome prospects all around the globe to call us for business enterprise cooperation.
TU-752 High-speed PCB, Now, with the development of internet, and the trend of internationalization, we've got decided to extend business to overseas market. With the propose of bringing more profits to oversea customers by providing directly abroad. So we have changed our mind, from home to abroad, hope to provide our customers more profit, and looking forward to more chance to make business.

Hot Products

  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA
  • HCPL-0710-500E

    HCPL-0710-500E

    HCPL-0710-500E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5M160ZE64C5N

    5M160ZE64C5N

    5M160ZE64C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C

    XC2VP70-6FFG1517C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX16-2CPG196I

    XC6SLX16-2CPG196I

    XC6SLX16-2CPG196I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU47DR-2FFVE1156I

    XCZU47DR-2FFVE1156I

    ​XCZU47DR-2FFVE1156I Embedded System on Chip (SoC) is a single-chip adaptive RF platform that can meet current and future industry needs. The Zynq UltraScale+RFSoC series can support all frequency bands below 6GHz, meeting the critical requirements of next-generation 5G deployment. At the same time, it can also support direct RF sampling for 14 bit analog-to-digital converters (ADCs) with a sampling rate of up to 5GS/S and 14 bit analog-to-digital converters (DACs) with a sampling rate of 10 GS/S, both of which have an analog bandwidth of up to 6GHz.

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