TMM10i PCB Manufacturers

Every single member from our large efficiency profits team values customers' requirements and organization communication for TMM10i PCB,Ro3003 mixed high frequency PCB,TMM13i PCB,Ro3003 High Frequency PCB,TMM10 PCB, In addition, we would properly guideline the shoppers about the application techniques to adopt our products and solutions as well as the way to select appropriate materials.
TMM10i PCB, Now, with the development of internet, and the trend of internationalization, we've got decided to extend business to overseas market. With the propose of bringing more profits to oversea customers by providing directly abroad. So we have changed our mind, from home to abroad, hope to give our customers more profit, and looking forward to more chance to make business.

Hot Products

  • XC6SLX100T-3FGG900I

    XC6SLX100T-3FGG900I

    XC6SLX100T-3FGG900I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XAZU5EV-1SFVC784Q

    XAZU5EV-1SFVC784Q

    ​XAZU5EV-1SFVC784Q is an FPGA chip launched by Xilinx, belonging to the XA Zynq UltraScale+MPSoC series. This chip integrates a feature rich 64 bit quad core Arm Cortex-A53 processor and dual core Arm Cortex-R5 processing system (PS), as well as the UltraScale architecture of Xilinx programmable logic (PL), all integrated into a single device. In addition, it also includes on-chip memory, multi port external memory interfaces, and a rich set of peripheral connection interfaces
  • Bluetooth Module HDI PCB

    Bluetooth Module HDI PCB

    Bluetooth module is a PCBA board with integrated Bluetooth function for short-range wireless communication. It is divided into Bluetooth data module and Bluetooth voice module by function.The following is about Bluetooth Module HDI PCB related, I hope to help you better understand Bluetooth Module HDI PCB.
  • XCVU11P-L2FLGB2104E

    XCVU11P-L2FLGB2104E

    ​XCVU11P-L2FLGB2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale series, using 20nm process technology. With its high performance and high integration, this chip provides powerful processing capabilities for various applications.
  • 10CL120YF484I7G

    10CL120YF484I7G

    10CL120YF484I7G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications. 10CL120YF484I7G is commonly used in applications such as industrial automation, gaming, and low-power embedded systems. The device is known for its low power consumption, low cost, and high processing capacity, making it an excellent choice for applications where cost and power consumption are critical factors.
  • XC6SLX100T-2FGG484I

    XC6SLX100T-2FGG484I

    XC6SLX100T-2FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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