Ro4350B high frequency PCB Manufacturers

Adhering into the theory of "quality, services, efficiency and growth", now we have gained trusts and praises from domestic and international shopper for Ro4350B high frequency PCB,Rogers high frequency PCB,Taconic high frequency PCB,Arlon high frequency PCB, Our really specialized process eliminates the component failure and offers our shoppers unvarying top quality, allowing us to control cost, plan capacity and maintain consistent on time delivery.
Ro4350B high frequency PCB, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective products and meticulous after-sales service. We firmly believe that: we are outstanding as we are specialized.

Hot Products

  • 8-layer FR408HR PCB

    8-layer FR408HR PCB

    8-layer FR408HR PCB substrate is suitable for: special substrate for communication and big data industries.The following is about 8 layer FR408HR, I hope to help you better understand 8 layer FR408HR.
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM53724B0KPB

    BCM53724B0KPB

    BCM53724B0KPB is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-1FBG900C

    XC7K325T-1FBG900C

    XC7K325T-1FBG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-3FLVC2104E

    XCVU7P-3FLVC2104E

    ​XCVU7P-3FLVC2104E also supports humidity sensitivity and adapts to different working environment requirements. The packaging form of this chip is BGA, which provides powerful logic processing capability and high-speed data transmission rate,
  • N4000-13EP PCB

    N4000-13EP PCB

    N4000-13EP PCB is a high-performance material launched by nelco. It is mainly used in aviation and communication fields, with TG value of 220 degrees, and is sold worldwide

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