Ro4003CLoPro high frequency PCB Manufacturers

We emphasize growth and introduce new goods into the market every year for Ro4003CLoPro high frequency PCB,Ro4003CLoPro high frequency circuit board,RO4360G2 low loss high frequency PCB,RO3010 high frequency microwave PCB,Ro4003CLoPro PCB, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
Ro4003CLoPro high frequency PCB, We strongly believe that technology and service is our base today and quality will create our reliable walls of future. Only we've better and better quality , could we achieve our customers and ourselves, too. Welcome customers all over the word to contact us for getting further business and reliable relationships. We have been always here working for your demands whenever you want.

Hot Products

  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM59101BKMLG

    BCM59101BKMLG

    BCM59101BKMLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM54220SB0IFBG

    BCM54220SB0IFBG

    BCM54220SB0IFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TG250 PCB

    TG250 PCB

    Tg250 PCB is made of polyimide material. It can withstand high temperature for a long time and does not deform at 230 degrees. It is suitable for high temperature equipment, and its price is slightly higher than that of ordinary FR4
  • 10M08DCU324I7G

    10M08DCU324I7G

    ​10M08DCU324I7G is a single-chip, non-volatile, low-cost programmable logic device (PLD) used for integrating the best system components. The highlights of 10M08DCU324I7G include: dual configuration flash memory for internal storage, user flash memory, support for instant boot, integrated analog-to-digital converter (ADC), and support for single-chip Nios II soft core processors. The 10M08DCU324I7G is an ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer electronics products.
  • XC6SLX25-2FTG256C

    XC6SLX25-2FTG256C

    XC6SLX25-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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