RF-10 PCB Manufacturers

super big size PCB The advantages of large size PCB lie in one-time and integrity, which reduces the confusion and trouble of piecewise connection, but the cost is relatively high.

​XC3S1000-5FTG256C is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Spartan series. This product has the following features and specifications:

When the 40-layer M6G high speed PCB is close to the parallel high-speed differential signal line pair, in the case of impedance matching, the coupling of the two lines will bring many advantages. However, it is believed that this will increase the attenuation of the signal and affect the transmission distance.

​XC6SLX100-2FGG676I is an FPGA chip launched by Xilinx, belonging to the CoolRunner II series. This chip has the following characteristics and advantages:

​XCZU4EV-2SFVC784I is a SoC FPGA chip produced by Xilinx, belonging to the Zynq UltraScale+series. This chip integrates four ARM Cortex-A53 MPCore processors, dual ARM Cortex-R5 processors, and ARM Mali-400 MP2 graphics processors, with rich peripheral interfaces and storage media support, such as DDR4 and LPDDR4 memory

XCVU9P-2FLGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 digital signal processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGB2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.