EM-890K HDI PCB Manufacturers

Part status: Active LAB/CLB number: 510720 Logic components/units number: 8937600 Total RAM bits: 79586918I/O number: 1976 Number of gates: - Voltage - XCVU19P-2FSVA3824E Power supply: 0.825V~0.876V Installation type: Surface mount type Working temperature: 0 ° C~100 ° C (TJ) Product packaging: 3824-BBGA, FCBGA

XCKU3P-1FFVB676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

5SGXMA4H2F35I3LN is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

10-layer R-F775 Rigid-Flex PCB is a new type of printed circuit board that combines the durability of a rigid PCB and the adaptability of a flexible PCB.medical and military equipment, companies in the mainland are also gradually increasing the proportion of rigid-flex boards in total output.

XC7A100T-1FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

High-power LED ceramic PCB--High-power LED copper-clad ceramic circuit board can effectively solve the heat dissipation problem of high-power LED thermal skew,Aluminum Nitride Ceramic base board substrate has the best overall performance and is the ideal substrate material for future high-power LEDs.