Double-sided aluminum oxide PCB Manufacturers

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Hot Products

  • 10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB In order to avoid confusion, the American IPC Circuit Board Association proposed to call this kind of product technology a common name for HDI (High Density Intrerconnection) technology. If it is directly translated, it will become a high-density interconnection technology. The following is about 10-Layer ELIC HDI PCB related, I hope to help you better understand 10-Layer ELIC HDI PCB.
  • XC7A75T-2FTG256C

    XC7A75T-2FTG256C

    XC7A75T-2FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-2FFG900C

    XC7K325T-2FFG900C

    ​XC7K325T-2FFG900C is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • XC6SLX75T-2FGG484I

    XC6SLX75T-2FGG484I

    XC6SLX75T-2FGG484I is a highly flexible and programmable # FPGA chip #. Its 268 input/output ports provide powerful circuit connectivity, enabling the chip to achieve efficient signal transmission and data processing in various applications.
  • XC4VFX100-11FFG1517I

    XC4VFX100-11FFG1517I

    XC4VFX100-11FFG1517I is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 101,261 logic cells, 2.8 Mb of distributed RAM, and 36 Digital Signal Processing (DSP) blocks, making it ideal for high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The -11 speed grade of this FPGA allows it to operate up to 550 MHz.
  • 28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.

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