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5SGXEA7N2F45C2N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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    XC7A75T-2FGG676I

    XC7A75T-2FGG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
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    XC7VX690T-3FFG1927E

    Xilinx XC7VX690T-3FFG1927E FPGA - Field Programmable Gate Array Package / Box FCBGA-1927 Series XC7VX690T
  • EP1S80F1020C5N

    EP1S80F1020C5N

    EP1S80F1020C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU13P-1FLGA2577E

    XCVU13P-1FLGA2577E

    ​XCVU13P-1FLGA2577E is an FPGA (Field Programmable Gate Array) product launched by Xilinx. This product belongs to the UltraScale+architecture, designed to meet a wide range of system requirements, with a particular focus on reducing total power consumption through multiple innovative technologies
  • BCM81328A0KFSBG

    BCM81328A0KFSBG

    BCM81328A0KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX230HF35C4G

    EP4SGX230HF35C4G

    This chip provides 230K logic units and integrates multiple high-speed communication interfaces such as PCIe 2.0 x8, high-speed serial connectors DDR3 memory controller, etc. The chip adopts manufacturing technology based on the 40 nanometer process, which has advantages such as efficient processing capacity, low power EP4SGX230HF35C4G consumption, and low cost. This chip has a wide range of applications in high-performance computing, network communication, video transcoding, and image processing.
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    Special attention should also be paid to the packaging of finished products of flexible circuit boards, rather than simply stacking an appropriate number of flexible boards together at will. Due to the complex structure of flexible printed board

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