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    In 1961, Hazelting Corp. of the United States published Multiplanar, which was the first pioneer in the development of multilayer boards. This method is almost the same as the method of manufacturing multilayer boards by using the through-hole method. After Japan stepped into this field in 1963, various ideas and manufacturing methods related to multi-layer boards were gradually spread all over the world. The following is about 14 Layer High TG PCB related, I hope to help you better understand 14 Layer High TG PCB.
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    XC7VX690T-2FFG1761C

    XC7VX690T-2FFG1761C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TPS79333DBVR

    TPS79333DBVR

    TPS79333DBVR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU-883 PCB

    TU-883 PCB

    TU-883 PCB The branch length in high-speed TTL circuits should be less than 1.5 inches. This topology takes up less wiring space and can be terminated with a single resistor match. However, this wiring structure makes the signal reception at different signal receiving ends asynchronous. The following is about 6mm Thick TU883 High speed Backplane related, I hope to help you better understand 6mm Thick TU-883 PCB.
  • 24G RO4003C RF PCB

    24G RO4003C RF PCB

    The RF module is designed with RO4003C 20mil thickness PCB board, but RO4003C does not have UL certification. Can some applications requiring UL certification be replaced by RO4350B with the same thickness?The following is about 24G RO4003C RF PCBrelated, I hope to help you better understand 24G RO4003C RF PCB
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    XC7VX415T-2FFG1158I

    ​XC7VX415T-2FFG1158I Field Programmable Gate Array (FPGA) is a device that uses stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
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    Semiconductor materials refer to materials with special electrical properties in electronics and quantum mechanics, including silicon, germanium, silicon nitride, gallium selenide, etc. The special properties of these materials enable them to be used as materials in electronic devices, such as transistors, diodes, solar cells, etc.

  • PCB layout principles

    Set the size of the board and frame according to the structural drawing, arrange the mounting holes, connectors and other devices that need to be positioned according to the structural elements, and give these devices non-movable attributes. Dimension the size according to the requirements of the process design specifications.

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    According to the base material, PCB can be divided into flexible circuit board, rigid circuit board and rigid flexible combination plate, which are used in different equipment according to different purposes.

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    Semiconductor refrigeration technology is widely used in the current refrigeration technology. During the growth of crops in the greenhouse, semiconductor refrigeration technology can effectively control the environmental temperature, especially for some plants with high requirements for the environment

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