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Hot Products

  • Large size PCB

    Large size PCB

    Large size PCB super big size pcb-oil rig main board:board thickness 4.0mm, 4layer, L1-L2 blind hole, L3-L4 blind hole, 4/4/4/4oz copper, Tg170, single panel size 820*850mm. oil rig main board:board thickness 4.0mm, 4layer, L1-L2 blind hole, L3-L4 blind hole, 4/4/4/4oz copper, Tg170, single panel size 820*850mm.
  • 16-layer Rigid-Flex PCB

    16-layer Rigid-Flex PCB

    The designer of 16-layer Rigid-Flex PCB can use a single component to replace the composite printed circuit board which is composed of multiple connectors, multiple cables and ribbon cables. The performance is stronger and the stability is higher. At the same time, the scope of design is limited to one component, and the available space is optimized by bending and folding lines like a paper swan.
  • 10AS066H3F34I2LG

    10AS066H3F34I2LG

    ​10AS066H3F34I2LG is an FPGA (Field Programmable Gate Array) product manufactured by Altera (now part of Intel). Here is a detailed introduction about 10AS066H3F34I2LG
  • XC7S75-1FGGA676C

    XC7S75-1FGGA676C

    ​XC7S75-1FGGA676C is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Spartan-7 series. This FPGA has the following features and specifications:
  • High Thermal Conductivity PCB

    High Thermal Conductivity PCB

    The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.
  • XC2S300E-6FGG456C

    XC2S300E-6FGG456C

    XC2S300E-6FGG456C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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