5CGXFC7D6F27I7N Manufacturers

Our products are extensively identified and reliable by consumers and will satisfy constantly developing economic and social desires for 5CGXFC7D6F27I7N, Special emphasis around the packaging of merchandise to avoid any damage during transportation,Detailed interest into the useful feedback and strategies of our esteemed shoppers.
5CGXFC7D6F27I7N, Now, we professionally supplies customers with our main products And our business is not only the "buy" and "sell", but also focus on more. We target to be your loyal supplier and long-term cooperator in China. Now, We hope to be the friends with you.

Hot Products

  • XCVU11P-2FLGB2104E

    XCVU11P-2FLGB2104E

    ​XCVU11P-2FLGB2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip adopts advanced 20nm process technology, providing excellent performance and integration, especially suitable for high-performance computing, network communication, video processing and other application fields. The main features of XCVU11P-2FLGB2104E chip include:
  • BCM56648KB0KFSBLG

    BCM56648KB0KFSBLG

    BCM56648KB0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7S50-2FGGA484C

    XC7S50-2FGGA484C

    XC7S50-2FGGA484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • New energy car Ceramic PCB

    New energy car Ceramic PCB

    New energy car Ceramic PCB is an ideal material for large-scale integrated circuits, semiconductor module circuits and high-power devices, heat dissipation materials, circuit components and interconnection line carriers.The following is about New energy car ceramic board, I hope to help you better understand New energy car ceramic board.
  • XC6SLX9-3TQG144I

    XC6SLX9-3TQG144I

    XC6SLX9-3TQG144I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CGXFC7C6F23I7N

    5CGXFC7C6F23I7N

    ​The 5CGXFC7C6F23I7N device integrates transceivers and hard memory controllers, suitable for industrial, wireless and wired, military, and automotive market applications

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