5CGXFC7D6F27I7N Manufacturers

XC7A75T-2FGG484I is a field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 52,160 logic cells, 2.7 Mb of block RAM, and 240 Digital Signal Processing (DSP) slices, making it suitable for a wide range of high-performance applications. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1000 MHz. The device comes in a fine-pitch ball grid array (FGG484I) package with 484 pins, providing high pin-count connectivity for a variety of applications. XC7A75T-2FGG484I is commonly used in industrial automation, aerospace and defense, telecom, and high-performance computing applications. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it an excellent choice for high-speed and high-reliability applications.

XC2C64A-7CP56I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

In the touch era, EM-370 PCB have been applied to various industrial equipment, such as industrial automation, gas station terminals, aircraft display screens, automotive GPS, medical equipment, bank POS and ATM machines, industrial measuring instruments, and high-speed rails, etc. Wait, a new industrial revolution is unfolding.The following is about4 layer EM-370 PCB, I hope to help you better understand 4 layer EM-370 PCB.

​5SGXMA3H2F35I3N is an FPGA (Field Programmable Gate Array) product produced by Intel/Altera, belonging to the Stratix V GX series. This FPGA has the following features and specifications:

ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.

​XCVU13P-2FHGA2104E is a high-performance FPGA chip produced by Xilinx, belonging to the Virtex UltraScale+series. This chip has the following main features