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5CGXFC7C6F23I7N Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I

    XC3S400AN-4FGG400I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC18V04VQG44C

    XC18V04VQG44C

    XC18V04VQG44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX485T-1FFG1157C

    XC7VX485T-1FFG1157C

    XC7VX485T-1FFG1157C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX4-2CPG196C

    XC6SLX4-2CPG196C

    XC6SLX4-2CPG196C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM54994EB0KFSBG

    BCM54994EB0KFSBG

    BCM54994EB0KFSBG is a high-performance chip designed for widespread use in network devices, data centers, the Internet of Things, and other fields
  • XC2V250-4CS144I

    XC2V250-4CS144I

    XC2V250-4CS144I is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company.
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  • Advantages and disadvantages of multilayer boards

    Multilayer boards were invented in 1961. Its production method is generally to make the inner layer graphics first, and then use the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the designated interlayer, and then heat, press and bond it. As for the subsequent drilling, It is the same as the plated through-hole method of the double-sided board.

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