4-layer via-in-PAD PCB Manufacturers

Our primary intention should be to offer our clientele a serious and responsible enterprise relationship, delivering personalized attention to all of them for 4-layer via-in-PAD PCB,Cross Blind Buried Hole PCB,Laser Blind Buried Hole PCB,VIA-in-PAD PCB,VIA in PAD PCB, We're seeking forward to forming successful business enterprise romantic relationship with new shoppers in the around upcoming!
4-layer via-in-PAD PCB, With many years good service and development, we've a professional international trade sales team. Our products and solutions have exported to North America, Europe, Japan, Korea, Australia, New Zealand, Russia and other countries. Looking forward to build up a good and long term cooperation with you in coming future!

Hot Products

  • EP4SGX530KH40I4

    EP4SGX530KH40I4

    ​EP4SGX530KH40I4G - Stratix IV GX High Density and High Performance Field Programmable Gate Array
  • 10CL16YE144I7G

    10CL16YE144I7G

    10CL16YE144I7G High performance: Adopting Intel's advanced process technology and architecture design, it has excellent logic density and operating frequency, which can meet the requirements of high-performance applications. Flexibility: It has programmability and can customize logical design according to user needs, flexibly adapting to different application scenarios.
  • Microstrip PCB

    Microstrip PCB

    Microstrip PCB refers to high-frequency PCB. For special circuit board with high electromagnetic frequency, generally speaking, high frequency board can be defined as frequency above 1GHz. The high frequency board comprises a core plate with a hollow groove and a copper clad plate bonded to the upper surface and the lower surface of the core board through flow glue. The edges of the upper opening and the lower opening of the hollow groove are provided with ribs.
  • EP3C55F484I7N

    EP3C55F484I7N

    EP3C55F484I7N is a type of FPGA (Field Programmable Gate Array) made by Intel (formerly Altera). This specific FPGA has 55,000 Logic Elements, operates at a speed of up to 350 MHz, and features 360Kb of embedded memory, 204 DSP blocks, and 4 PLLs. It is commonly used in a range of applications, including motor control, sensory data aggregation, and low-power embedded processing.
  • XC3S200AN-4FT256I

    XC3S200AN-4FT256I

    XC3S200AN-4FT256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XAZU5EV-1SFVC784Q

    XAZU5EV-1SFVC784Q

    ​XAZU5EV-1SFVC784Q is an FPGA chip launched by Xilinx, belonging to the XA Zynq UltraScale+MPSoC series. This chip integrates a feature rich 64 bit quad core Arm Cortex-A53 processor and dual core Arm Cortex-R5 processing system (PS), as well as the UltraScale architecture of Xilinx programmable logic (PL), all integrated into a single device. In addition, it also includes on-chip memory, multi port external memory interfaces, and a rich set of peripheral connection interfaces

Send Inquiry