4-Layer Rigid-Flex PCB Manufacturers

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Hot Products

  • 10M08DFV81I8G

    10M08DFV81I8G

    10M08DFV81I8G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C

    XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.
  • 100G Optical Module PCB

    100G Optical Module PCB

    Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion. The transmitting end of the optical module converts the electrical signal into an optical signal, and the receiving end converts the optical signal into an electrical signal. The optical modules are classified according to the packaging form. Common ones include SFP, SFP +, SFF, and Gigabit Ethernet interface converter (GBIC).The following is about 100G Optical Module PCB related, I hope to help you better understand 100G Optical Module PCB.
  • EP2C70F672I8N

    EP2C70F672I8N

    ​EP2C70F672I8N is an FPGA chip produced by Altera Corporation, belonging to the Cyclone II series. This chip adopts TSMC's 90nm low-k dielectric process and is manufactured on 300mm wafers, aiming to provide fast availability and low cost while supporting complex digital systems
  • EM-888 PCB

    EM-888 PCB

    For example, from the perspective of production process testing, IC testing is generally divided into chip testing, finished product testing, and inspection testing. Unless otherwise required, chip testing generally only conducts DC testing, and finished product testing can have either AC testing or DC testing. In more cases, both tests are available. The following is about EM-888 PCB related, I hope to help you better understand EM-888 PCB.
  • XCVU35P-3FSVH2104E

    XCVU35P-3FSVH2104E

    XCVU35P-3FSVH2104E is an electronic component, specifically an FPGA (Field Programmable Gate Array) chip produced by Xilinx. The following is a detailed introduction about XCVU35P-3FSVH2104E

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