32-Layer Rigid-Flex PCB Manufacturers

Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" as well as the theory of "quality the basic, have confidence in the very first and management the advanced" for 32-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,36-Layer Rigid-Flex PCB,AP9141R Rigid-Flex PCB,24-Layer Rigid-Flex PCB, Our goods are strictly inspected before exporting , So we gain a excellent standing all around the planet. We wanting ahead to cooperation with you in the foreseeable future.
32-Layer Rigid-Flex PCB, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • XC6SLX150T-3CSG484I

    XC6SLX150T-3CSG484I

    XC6SLX150T-3CSG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C50F672I8N

    EP2C50F672I8N

    EP2C50F672I8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EPM7256AETC144-10N

    EPM7256AETC144-10N

    EPM7256AETC144-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM68782A1KFEBG

    BCM68782A1KFEBG

    BCM68782A1KFEBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400A-4FTG256C

    XC3S400A-4FTG256C

    The XC3S400A-4FTG256C chip adopts Xilinx's Virtex-3 series FPGA, which is known for its high-performance logic units and memory resources, and can achieve high-speed digital signal processing and data processing. This chip supports various applications such as digital signal processing, communication, and digital control, with rich digital interfaces and I/O interfaces, making it easy to connect with other digital and analog devices
  • XC7S75-2FGGA676I

    XC7S75-2FGGA676I

    ​XC7S75-2FGGA676I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, manufactured using a 28nm process. This chip has 48000 logic units and 76800 programmable units, providing high-performance digital signal processing and data processing capabilities.

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