32-Layer Rigid-Flex PCB Manufacturers

Our eternal pursuits are the attitude of "regard the market, regard the custom, regard the science" as well as the theory of "quality the basic, have confidence in the very first and management the advanced" for 32-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,36-Layer Rigid-Flex PCB,AP9141R Rigid-Flex PCB,24-Layer Rigid-Flex PCB, Our goods are strictly inspected before exporting , So we gain a excellent standing all around the planet. We wanting ahead to cooperation with you in the foreseeable future.
32-Layer Rigid-Flex PCB, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • 10AX048E3F29E2SG

    10AX048E3F29E2SG

    10AX048E3F29E2SG is a field programmable gate array (FPGA) chip produced by Intel (formerly Altera brand, now under Intel), belonging to the Arria 10 series
  • XC7A35T-2CSG325I

    XC7A35T-2CSG325I

    XC7A35T-2CSG325I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP4SGX230FF35C4G

    EP4SGX230FF35C4G

    EP4SGX230FF35C4G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCKU15P-2FFVA1156I

    XCKU15P-2FFVA1156I

    ​XCKU15P-2FFVA1156I Kintex® UltraScale+ ™ The device provides high cost-effectiveness in FinFET nodes. This FPGA series is an ideal choice for packet processing and DSP intensive functions, and is suitable for various applications ranging from wireless MIMO technology to Nx100G networks and data centers.
  • 100G optoelectronic PCB

    100G optoelectronic PCB

    100G optoelectronic PCB is a packaging substrate for a new generation of high computing, which integrates light with electricity, transmits signals with light and operates with electricity. It adds a layer of light guide to the traditional printed circuit board, which is very mature at present.
  • 5M2210ZF256C5N

    5M2210ZF256C5N

    5M2210ZF256C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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