32-Layer Meg6 High-speed Backplane Manufacturers

The corporate keeps to the procedure concept "scientific administration, premium quality and performance primacy, buyer supreme for 32-Layer Meg6 High-speed Backplane,megtron6 high-speed backplane,megtron7 high-speed PCB,megtron4 high-speed PCB,high-speed PCB, Welcome any inquiry to our firm. We're going to be glad to establish pleasant business interactions with you!
32-Layer Meg6 High-speed Backplane, Upon today, we have customers from all over the world, including USA, Russia, Spain, Italy, Singapore, Malaysia, Thailand, Poland, Iran and Iraq. The mission of our company is to provide the highest quality products with best price. We are looking forward to doing business with you.

Hot Products

  • TPS54478RTER

    TPS54478RTER

    TPS54478RTER is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2C8F256C8N

    EP2C8F256C8N

    EP2C8F256C8N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • N4000-13EP PCB

    N4000-13EP PCB

    N4000-13EP PCB is a high-performance material launched by nelco. It is mainly used in aviation and communication fields, with TG value of 220 degrees, and is sold worldwide
  • EP2AGX190FF35I3G

    EP2AGX190FF35I3G

    EP2AGX190FF35I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU29P-2FSGA2577I

    XCVU29P-2FSGA2577I

    ​XCVU29P-2FSGA2577I is an electronic component from Xilinx, specifically part of the UltraScale+FPGA (Field Programmable Gate Array) series. The following is a detailed introduction to XCVU29P-2FSGA2577I:
  • HCPL-0631-500E

    HCPL-0631-500E

    HCPL-0631-500E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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