24 layers ELIC HDI PCB Manufacturers

We depend on sturdy technical force and continually create sophisticated technologies to satisfy the demand of 24 layers ELIC HDI PCB,22 layers of 3step HDI PCB,26 layers of 2step HDI PCB, Our skilled complex workforce is going to be wholeheartedly at your assistance. We sincerely welcome you to definitely pay a visit to our site and firm and deliver us your inquiry.
24 layers ELIC HDI PCB, Our product quality is one of the major concerns and has been produced to meet the customer's standards. "Customer services and relationship" is another important area which we understand good communication and relationships with our customers is the most significant power to run it as a long term business.

Hot Products

  • 10AS048H3F34E2SG

    10AS048H3F34E2SG

    10AS048H3F34E2SG is an FPGA chip with excellent performance and broad application prospects. It features high performance, low power consumption, flexibility, and reliability, making it suitable for application scenarios that require these characteristics
  • 10M08DAF256C8G

    10M08DAF256C8G

    ​10M08DAF256C8G is an FPGA (Field Programmable Gate Array) product produced by Intel. This FPGA belongs to the MAX 10 series and has the following features and specifications
  • Tachyon 100G PCB

    Tachyon 100G PCB

    Tachyon 100G PCB The exposure equipment is in the same environment. The alignment tolerance of the front and back images of the entire area must be maintained at 0.0125mm. The CCD camera is required to complete the front and rear layout alignment. After etching, the four-hole drilling system was used to perforate the inner layer. The perforation passes through the core board, the position accuracy is maintained at 0.025mm, and the repeatability is 0.0125mm. The following is about Tachyon 100G High-speed PCB related, I hope to help you better understand Tachyon 100G High-speed PCB.
  • XA6SLX4-2CSG225Q

    XA6SLX4-2CSG225Q

    XA6SLX4-2CSG225Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-2FLVB2104E

    XCVU7P-2FLVB2104E

    ​XCVU7P-2FLVB2104E is a Field Programmable Gate Array (FPGA) developed by Xilinx, packaged in BGA-2104 format. This FPGA belongs to Virtex ™ The UltraScale+series, designed on 14nm/16nm FinFET nodes, provides high-performance and highly integrated functionality.
  • XC3S400A-4FTG256C

    XC3S400A-4FTG256C

    The XC3S400A-4FTG256C chip adopts Xilinx's Virtex-3 series FPGA, which is known for its high-performance logic units and memory resources, and can achieve high-speed digital signal processing and data processing. This chip supports various applications such as digital signal processing, communication, and digital control, with rich digital interfaces and I/O interfaces, making it easy to connect with other digital and analog devices

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