24-Layer Rigid-Flex PCB Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Customer need is our God for 24-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,32-Layer Rigid-Flex PCB,36-Layer Rigid-Flex PCB,AP9141R Rigid-Flex PCB, With our rules of " organization track record, partner trust and mutual benefit", welcome all of you to function together , improve jointly.
24-Layer Rigid-Flex PCB, With the effort to keep pace with world's trend, we are going to always endeavor to meet customers' demands. If you want develop any other new products and solutions, we can customize them in your case. If you feel interest in any of our goods or want develop new merchandise, remember to feel free to contact us. We're looking forward to forming successful business relationship with customers all over the world.

Hot Products

  • XC2S50E-6FTG256C

    XC2S50E-6FTG256C

    XC2S50E-6FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGTFD7K3F40I3N

    5AGTFD7K3F40I3N

    5AGTFD7K3F40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX150-3FGG484I

    XC6SLX150-3FGG484I

    ​XC6SLX150-3FGG484I is a high-performance, low-power FPGA chip produced by Xilinx, belonging to the Spartan-6 series. This chip adopts advanced manufacturing processes and has the characteristics of high integration and small size. Its main frequency reaches a certain level and can cope with complex computing tasks.
  • MT29F2G08ABAGAWP-IT:G

    MT29F2G08ABAGAWP-IT:G

    MT29F2G08ABAGAWP-IT:G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCZU7EV-2FBVB900E

    XCZU7EV-2FBVB900E

    XCZU7EV-2FBVB900E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP1S40F1020C5N

    EP1S40F1020C5N

    EP1S40F1020C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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