24-Layer Rigid-Flex PCB Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Customer need is our God for 24-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,32-Layer Rigid-Flex PCB,36-Layer Rigid-Flex PCB,AP9141R Rigid-Flex PCB, With our rules of " organization track record, partner trust and mutual benefit", welcome all of you to function together , improve jointly.
24-Layer Rigid-Flex PCB, With the effort to keep pace with world's trend, we are going to always endeavor to meet customers' demands. If you want develop any other new products and solutions, we can customize them in your case. If you feel interest in any of our goods or want develop new merchandise, remember to feel free to contact us. We're looking forward to forming successful business relationship with customers all over the world.

Hot Products

  • XCVU13P-2FLGA2577I

    XCVU13P-2FLGA2577I

    XCVU13P-2FLGA2577I Minimum operating temperature -40C Maximum operating temperature +100℃ Installation mode SMD/SMT Package: FBGA-2577 Data rate 30.5 Gb/s Quantity: 156PCS Batch :2023+
  • EP3C25U256C7N

    EP3C25U256C7N

    ​EP3C25U256C7N is an FPGA (Field Programmable Gate Array) launched by Intel. This FPGA belongs to the Cyclone III series and has the following key features and specifications
  • XCZU1CG-L1UBVA494I

    XCZU1CG-L1UBVA494I

    XCZU1CG-L1UBVA494I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256I5N

    EPM1270F256I5N

    EPM1270F256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S700A-4FGG484C

    XC3S700A-4FGG484C

    XC3S700A-4FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270T144C4N

    EPM1270T144C4N

    EPM1270T144C4N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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