20-Layer Rigid-Flex PCB Manufacturers

To constantly improve the management system by virtue of the rule of "sincerely, good faith and quality are the base of enterprise development", we widely absorb the essence of related products internationally, and constantly develop new products to meet the demands of customers for 20-Layer Rigid-Flex PCB,18-Layer Rigid-Flex PCB,22-Layer Rigid-Flex PCB,24-Layer Rigid-Flex PCB,26-Layer Rigid-Flex PCB, We warmly welcome you to set up cooperation and generate a bright long term together with us.
20-Layer Rigid-Flex PCB, We pay high attention to customer service, and cherish every customer. We now have maintained a strong reputation in the industry for many years. We've been honest and work on building a long-term relationship with our customers.

Hot Products

  • XC7VX485T-2FFG1761I

    XC7VX485T-2FFG1761I

    XC7VX485T-2FFG1761I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • RT6002

    RT6002

    RT6002 promotes continuous breakthroughs in reliability, efficiency and performance in the field of materials by providing advanced material technology, applied knowledge and global production and design collaboration.
  • XCVU9P-1FLGA2577I

    XCVU9P-1FLGA2577I

    XCVU9P-1FLGA2577I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-4FGG456I

    XC3S1000-4FGG456I

    XC3S1000-4FGG456I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU15P-L2FFVA1156E

    XCKU15P-L2FFVA1156E

    XCKU15P-L2FFVA1156E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-1FFG900C

    XC7K325T-1FFG900C

    ​XC7K325T-1FFG900C is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.

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