2-step HDI PCB Manufacturers

owing to excellent support, a variety of top of the range items, aggressive rates and efficient delivery, we enjoy a very good reputation among our clients. We have been an energetic firm with wide market for 2-step HDI PCB,6-Layer HDI PCB,via-in-PAD PCB,3-step HDI PCB, We sincerely welcome domestic and foreign merchants who calls, letters asking, or to plants to negotiate, we will offer you quality products and the most enthusiastic service,We look forward to your visit and your cooperation.
2-step HDI PCB, As an experienced group we also accept customized order and make it same as your picture or sample specifying specification and customer design packing. The main goal of our company is to build up a satisfactory memory to all customers, and establish a long term win-win business relationship. Choose us, we always wait for your appearance!

Hot Products

  • XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I

    XC6SLX75T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • BCM68622B0IFSBG

    BCM68622B0IFSBG

    BCM68622B0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K355T-3FFG901E

    XC7K355T-3FFG901E

    XC7K355T-3FFG901E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C25U256C7N

    EP3C25U256C7N

    ​EP3C25U256C7N is an FPGA (Field Programmable Gate Array) launched by Intel. This FPGA belongs to the Cyclone III series and has the following key features and specifications
  • EM-888 HDI PCB

    EM-888 HDI PCB

    EM-888 HDI PCB is the abbreviation of high density interconnection. It is a kind of printed circuit board (PCB) production. It is a circuit board with high line distribution density using micro blind buried hole technology. EM-888 HDI PCB is a compact product designed for small capacity users.

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